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Analysis of current Board Test Problems from an industrial standpoint

Modern electronic Boards are equipped more and more with BGA, high speed links, FPGA and complex microprocessors. But the progress in packaging technologies and high speed structures changing failure phenomens and causing increased production test problems.The presentation reviews the current situation and is discussing the paradigm change for production test instrumentation and the challenges for ATE vendors. In the last part of the lecture some future oriented
problems are discussed to stimulate more academic research projects in the domain of board test.